Rubber Technology
Rubber Compression Set Explained: The Critical Seal Performance Metric
In-depth guide to rubber compression set (CS): physical mechanism, ASTM D395/ISO 815 test methods, material CS values comparison, and key strategies for low-CS compound design including peroxide cure, post-curing, and filler optimization.
Article Info
- Category
- Rubber Technology
- Tags
- Compression SetSeal DesignASTM D395Peroxide CurePost-Curing
- Keywords
- compression set / rubber seal performance / ASTM D395 / low compression set / Nanjing Yuhang Rubber
Expertise Signal
- Technical review
- YuHang Rubber Technical Team
- Review Role
- Industrial Rubber Product Technical Review
- Known For
- Rubber FenderRubber TrackRubber SheetRubber HoseRubber ExtrusionCustom Rubber Parts
Industrial rubber product manufacturer covering rubber fenders, rubber tracks, rubber sheets, rubber hoses, extrusions, belts and custom molded rubber parts.

Rubber Compression Set Explained
Published: 2026-05-25 | Reading time: 7 minutes
What Is Compression Set?
Compression Set (CS) is the percentage of a rubber specimen's original deflection that is not recovered after a specified compression period at a specified temperature. In simple terms: you compress a rubber sample to a fixed thickness, hold it at a specified temperature for a specified time, release it, and measure how much of the compression it "remembers." A low CS (approaching 0%) means the rubber springs back almost completely -- excellent for seals. A high CS (approaching 100%) means the rubber stays permanently deformed after compression -- catastrophic for seals.
The standard calculation:
CS (%) = [(t₀ - tᵣ) / (t₀ - tₛ)] x 100
Where:
- • t₀ = original thickness of the specimen before compression
- • tᵣ = recovered thickness 30 minutes after releasing compression
- • tₛ = spacer thickness (the thickness to which the specimen is compressed, typically 75% of t₀ for 25% compression)
Example calculation: A 10.00 mm specimen compressed to 7.50 mm (25% compression) that recovers to 9.50 mm: CS = [(10.00 - 9.50) / (10.00 - 7.50)] x 100 = (0.50 / 2.50) x 100 = 20% -- a fairly good result for a general-purpose seal.
Why Compression Set Matters -- The Seal Failure Mechanism
An O-ring or gasket works by exerting a continuous sealing force against the mating surfaces. This force comes from the rubber's elastic recovery -- its tendency to push back against the compression it was installed under. When compression set occurs, the rubber permanently deforms, and the sealing force decays.
The failure sequence:
- Seal installed at 20-25% compression -- initial sealing force established
- Over time at service temperature, physical and chemical relaxation processes reduce the elastic recovery
- Sealing force progressively decreases as compression set increases
- When compression set reaches approximately 80-90% (sealing force approaches zero), the seal leaks
- Failure may occur even before leakage -- a seal with >80% CS may not survive a system pressure surge or temperature cycle
Physical Mechanism -- Two Simultaneous Processes
Two distinct processes occur simultaneously when rubber is held under compression at elevated temperature:
1. Physical Relaxation (Partially Recoverable)
Polymer chains under strain undergo conformational rearrangement -- they reptate (snake) through entanglements to adopt lower-energy configurations that relieve the imposed stress. This is a physical process involving chain movement through entanglements, not breaking or forming chemical bonds. Over time (minutes to hours), the stress decays even in the absence of any chemical change.
- • At room temperature: physical relaxation is slow (hours to days) because chain mobility is limited
- • At elevated temperature (>Tg + 30°C): chain mobility increases exponentially, and physical relaxation accelerates
- • This component is partially recoverable -- if the rubber is heated unconstrained (e.g., during post-curing), some physical relaxation may recover
- • Contribution to total CS: roughly 30-50% at moderate temperatures
2. Chemical Relaxation (Irrecoverable)
Two competing chemical processes change the network structure:
Chain scission: Thermal energy or oxidative attack breaks polymer backbone bonds or crosslinks. Fewer crosslinks = less elastic recovery force. Broken chains have no memory of their pre-deformation configuration.
New crosslink formation: Radical recombination creates new crosslinks between chains in their compressed (deformed) configuration. These new crosslinks "lock in" the deformed state -- the rubber has chemically adapted to being compressed. When released, these new crosslinks resist expansion back to the original shape.
The balance between chain scission and new crosslinking determines the net effect:
- • New crosslinking dominates in NR, SBR, NBR, EPDM, CR -- compression set from network rearrangement
- • Chain scission dominates in IIR (butyl) -- compression set from molecular weight reduction
- • Both contribute in HNBR and FKM at their upper temperature limits
Chemical relaxation is irrecoverable -- no post-treatment can reverse chemically locked-in deformation.
Test Methods
| Standard | Method | Compression | Typical Conditions |
|---|---|---|---|
| ASTM D395 Method B | Constant deflection | 25% (to 75% of original thickness) | 70/100/125/150/175/200°C x 22/70/168/336/1000h |
| ISO 815-1 | Constant deflection | 25% | Same temperature and time ranges |
| ISO 815-2 | Low-temperature CS | 25% | Sub-ambient temperatures (e.g., -10°C, -25°C) |
| GB/T 7759 | Constant deflection | 25% | Equivalent to ISO 815-1 |
| ASTM D395 Method A | Constant force (rarely used for seals) | Variable (force-controlled) | Used mainly for research |
Test Procedure Detail (ASTM D395 Method B)
- Measure original thickness (t₀) of each specimen (standard: 12.5 mm or 6.3 mm thick disc, 29 mm or 13 mm diameter)
- Assemble specimens between parallel steel plates with spacer bars (tₛ) that enforce the specified compression (typically 75% of original thickness)
- Place the compressed assembly in an oven at the specified test temperature for the specified duration
- Remove from oven, disassemble, and allow specimens to recover for 30 minutes at room temperature (23±2°C) on a thermally non-conductive surface
- Measure recovered thickness (tᵣ)
- Calculate CS
Critical Test Variables
| Variable | Effect on CS | Recommendation |
|---|---|---|
| Specimen geometry | Larger diameter:thickness ratio reduces buckling | Use standard specimens per ASTM |
| Spacer consistency | Uneven compression causes scatter | Calibrate spacer thickness to ±0.01 mm |
| Recovery time | CS decreases with longer recovery (some physical relaxation recovers) | Standardize at exactly 30 minutes per ASTM |
| Recovery temperature | Higher temperature during recovery increases recovery | Standardize at 23±2°C |
| Oven temperature uniformity | Hot spots produce artificially high CS | Verify oven temperature mapping (±1°C) |
| Specimen lubrication | Sticking to plates increases CS (triaxial stress) | Light silicone oil on plates per ASTM |
| Post-cure before testing | Parts not post-cured will show higher CS in test | Standardize post-cure or test as-is per application |
Material CS Values Comparison
| Material | CS (70°Cx22h) | CS (100°Cx70h) | CS (125°Cx70h) | CS (150°Cx168h) | CS (175°Cx168h) |
|---|---|---|---|---|---|
| NR | 20-40% | — | — | — | — |
| SBR | 15-30% | — | — | — | — |
| NBR (sulfur CV) | 25-40% | 40-60% | — | — | — |
| NBR (sulfur EV) | 15-25% | 30-50% | — | — | — |
| NBR (peroxide) | 10-18% | 20-30% | 30-45% | — | — |
| EPDM (sulfur CV) | 20-35% | 35-55% | 55-75% | — | — |
| EPDM (sulfur EV) | 15-25% | 25-40% | 40-60% | 50-70% | — |
| EPDM (peroxide) | 8-15% | 12-25% | 18-35% | 30-50% | — |
| CR | 15-25% | 25-40% | 40-55% | — | — |
| HNBR (peroxide) | 10-18% | 15-25% | 18-30% | 25-40% | 40-55% |
| FKM (bisphenol) | 8-15% | 12-20% | 14-22% | 15-25% | 18-30% |
| FKM (peroxide) | 8-12% | 10-18% | 12-22% | 15-25% | 18-28% |
| Silicone | 5-12% | 10-20% | 12-25% | 15-30% | 20-35% |
| FVMQ (fluorosilicone) | 8-15% | 12-22% | 15-25% | 18-30% | — |
| FFKM | 5-12% | 8-15% | 10-18% | 12-22% | 15-25% |
What Determines CS Performance?
Cure System -- The Single Largest Factor
| Cure System | Crosslink Bond Energy | CS Relative Performance | Mechanism |
|---|---|---|---|
| CV Sulfur (C-Sx-C) | ~150 kJ/mol | ★★ Poor | Polysulfidic bonds break and reform under heat + stress |
| SEV Sulfur (mixed) | ~150-285 kJ/mol | ★★★ Fair | Reduced polysulfidic fraction |
| EV Sulfur (C-S-C) | ~285 kJ/mol | ★★★★ Good | Monosulfidic bonds more stable; fewer rearrangements |
| Peroxide (C-C) | ~350 kJ/mol | ★★★★★ Excellent | C-C bonds most stable; minimal thermal rearrangement |
| Metal oxide (CR) | ~250 kJ/mol | ★★★★ Good | Ionic/cluster crosslinks; partially reversible |
| Bisphenol (FKM) | ~300 kJ/mol | ★★★★★ Excellent | Aromatic crosslink; very thermally stable |
Filler Type and Loading
| Filler Parameter | Effect on CS | Explanation |
|---|---|---|
| Higher filler loading | Reduces CS (improves) up to a point | Rigid filler particles constrain chain mobility; reduce physical relaxation |
| Excessive filler (>60-80 phr) | Increases CS (worsens) | Filler-filler network formation creates additional hysteresis |
| High-structure CB (N330 > N550 > N774) | Reduces CS (improves) | Higher structure provides more constrained rubber (bound rubber) |
| Non-black fillers (silica, clay) | Generally higher CS than CB | Less polymer-filler interaction, less bound rubber |
Antioxidant System
Heat-resistant antioxidants (TMQ, ZMTI, MBI, diphenylamine derivatives) protect against oxidative chain scission and crosslinking during the CS test. Without adequate antioxidant protection, oxidative hardening (new crosslinks formed in the compressed state) dramatically increases CS.
| Antioxidant System | Recommended For | Typical CS Improvement |
|---|---|---|
| TMQ (1-2 phr) alone | NR, SBR, general purpose | Baseline |
| TMQ + 6PPD (1-2 phr each) | NBR, outdoor/ozone-resistant | 10-20% reduction |
| TMQ + ZMTI/MBI | NBR/EPDM >120°C | 15-25% reduction |
| Diphenylamine derivatives + ZMTI | HNBR, high-temp | 20-30% reduction |
Post-Curing
Post-curing (a secondary bake after molding) provides three benefits for CS:
- Completes residual cure: Certain crosslinking reactions complete slowly. Post-curing drives them to completion, stabilizing the network before it enters service.
- Removes volatiles: Low-molecular-weight species (unreacted curatives, decomposition byproducts) act as internal plasticizers that increase physical relaxation. Post-curing drives them out.
- Relaxes molded-in stresses: The physical relaxation component that would occur in service (and contribute to CS) is partially induced during post-curing in the unconstrained state.
| Material | Typical Post-Cure | CS Reduction |
|---|---|---|
| NBR (EV sulfur) | 100°C x 2-4h | 10-15% |
| EPDM (peroxide) | 150°C x 2-4h | 15-20% |
| HNBR (peroxide) | 150°C x 4h | 15-25% |
| FKM (bisphenol) | 200-230°C x 16-24h | 20-30% (FKM post-cure is essential, not optional) |
| Silicone (peroxide) | 200°C x 4h | 15-25% |
| Silicone (platinum) | 150°C x 2-4h (optional) | 5-10% |
Four Core Strategies for Low CS
1. Peroxide Cure (When Compatible with Polymer)
C-C crosslinks (bond energy ~350 kJ/mol) are far more thermally stable than C-Sx-C polysulfidic crosslinks (~150 kJ/mol). Switching from sulfur to peroxide cure typically reduces CS by 30-50% at the same test temperature. This is the single most effective formulation change.
Limitations: Peroxide cure is not optimal for NR and SBR (inefficient due to few allylic hydrogens; chain scission competes with crosslinking). EPDM, HNBR, and Silicone are ideally suited for peroxide cure.
2. High-Structure Carbon Black
Using higher-structure grades (N330 instead of N550, N550 instead of N774) reduces CS by increasing the bound rubber content. More polymer chains are physically immobilized on the carbon black surface and cannot undergo the conformational rearrangement that contributes to physical relaxation.
3. Post-Curing -- Always for Critical Seals
A secondary bake (e.g., 150°C x 4h for EPDM, 200°C x 16-24h for FKM) completes residual cure, removes volatiles, and stabilizes the network. This can reduce CS by an additional 10-30%, depending on material. For FKM, post-curing is not optional -- uncured FKM has very high CS; post-curing is essential to achieve specified CS values.
4. Heat-Resistant Antioxidant Package
For service temperatures above 100°C, standard antioxidants (TMQ, 6PPD) provide inadequate protection. Add ZMTI (zinc 2-mercaptotoluimidazole) or MBI (2-mercaptobenzimidazole) at 0.5-1.5 phr for superior high-temperature oxidation resistance. ZMTI is particularly effective in NBR and EPDM at 120-150°C.
CS Acceptance Criteria by Application
| Application | Max CS (typical) | Test Condition | Rationale |
|---|---|---|---|
| Precision O-rings (aerospace/hydraulic) | ≤15% | 100°C x 70h | Near-zero leak tolerance |
| Hydraulic cylinder seals | ≤20% | 100°C x 70h | Continuous sealed pressure |
| Automotive engine seals | ≤25% | 125°C x 70h | Elevated temperature + vibration |
| Flange gaskets (standard) | ≤25% | 100°C x 22h | Bolted joint maintains some compression |
| Flange gaskets (high-temp) | ≤30% | 150°C x 70h | Gasket relaxation is primary failure mode |
| Construction weatherstrips | ≤30% | 70°C x 22h | Low pressure differential; cosmetic function |
| Automotive cooling system seals | ≤25% | 125°C x 70h | Coolant + elevated temperature |
| Oilfield downhole seals | ≤25% | 150°C x 168h+ | Extreme temperature + long service intervals |
| Consumer product seals | ≤35% | 70°C x 22h | Low criticality, planned replacement |
Low-Temperature Compression Set
Standard CS testing is performed at elevated temperature. However, for seals operating at low temperatures (-20°C to -60°C), low-temperature CS (ISO 815-2) is equally important. At low temperatures:
- • Chain mobility is drastically reduced
- • Physical relaxation is slow (which is good for CS)
- • BUT: if the temperature approaches Tg, the material is glassy and may not seal at all
- • Low-temperature CS testing typically shows lower numerical values than high-temperature CS -- the dominant concern is glass transition, not permanent set
Inquiry & Technical Support
Nanjing Yuhang Rubber has extensive experience in low-compression-set compound design for critical sealing applications. For material recommendations, CS testing, and compound development: Products | Materials | Contact
FAQ
Can this article be used as the final selection basis?
It is intended for preliminary technical review. Final material or product selection should be confirmed with the actual medium, temperature, load, dimensions, drawings and sample testing when needed.
What information should be provided for an inquiry?
Please provide the application equipment, working medium, temperature range, dimensions, quantity, drawing or sample information so the technical discussion can be organized faster.